Strategic Activities

Packaging and Development

Packaging Technology

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Pb-free Development Program

Strategic Activities

AMD began formulating its lead-free strategy in early 1999. Strategic activities included:
- Seeking customer inputs.
- Defining the Packaging Roadmap Project.
- Published the Pb-Free Strategic Plan 2000—2003 to identify issues and strategy for implementation.
AMD continues to participate in industry activities by:
- Engaging in continuous discussions with its customers, competitors, and contract assemblers.
- Analyzing the state of the industry: Lead Free Electronics Assembly (Reprinted by permission of Prismark Partners LLC)
- Becoming an active member in key organizations:
  - Cooperative Industry Consortia
    - Board reliability: NEMI (National Electronics Manufacturing Initiative, Inc.)
    - Component reliability: HDPUG (High Density Packaging Users Group)
    - Assembly processes/quality standards: IPC
    - EPA Lead-Free Project
  - Industry Trade Groups
    - AeA (American Electronics Association)
    - EIA (Electronic Industries Alliance)
    - ESIA (European Semiconductor Industry Association)
    - SIA (Semiconductor Industry Association)
    - JEDEC (JEDEC Solid State Technology Association)
  - University Research
    - Semiconductor Research Corporation (SRC)
  - Technical Resources

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