For more detailed information, follow the links to the Pb-Free Roadmap, Legislative Activities, Strategic Activities, and Development web sites.

• EU proposes legislation that restricts the use of Pb in electronic assemblies.
• First reading of proposed Pb phase-out in EU Parliament was in May 2001.
• Second reading in EU Parliament took place in April 2002.
• Concilation Committee convened September 2002
• Concilation completed October 2002
• WEEE and RoHS directives published in February 2003

• On-going customer dialog is required to ascertain the need for processor products that are compliant with Pb-free requirements.
• Exchange communication with partners and competitors in order to keep abreast of technologic and strategic changes.
• Review of current package performance and manufacturability issues.
• Alignment of internal resources to address manufacturing changes.

• Completed review of product compatibility with high temperature reflow profiles for compatibility with Pb-free manufacturing processes.
• Determination of best choice for high temperature materials.
• Evaluation of costs versus marketability of high temperature and/or Pb-free components.
• Manufacturing requirements may prevent production of both Pb-free and Pb-solder products on the same line.

• pb.free@amd.com