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AMD PowerNow!™ Technology


The AMD64 core provides leading-edge 32-bit performance and support for future 64-bit applications

  • AMD64 technology provides full speed support for x86 code base for exceptional 32-bit performance, with readiness for 64-bit applications
  • 40-bit physical addresses, 48-bit virtual addresses
  • Eight new (sixteen total) 64-bit integer registers
  • Eight new (sixteen total) 128-bit SSE/SSE2 registers
  • Including support for 3DNow!™ Professional technology and SSE2


Enhanced Virus Protection with the upcoming Windows® XP SP2

  • Enhanced Virus Protection together with the upcoming Windows XP Service Pack 2 are designed to prevent the spread of certain viruses, like MSBlaster and Slammer; significantly reducing the cost and down-time associated with similar viruses and improving the protection of computers and personal information against certain PC viruses

A high-bandwidth, low-latency integrated DDR memory controller
  • Supports PC3200, PC2700, PC2100 or PC1600 DDR SDRAM
  • Unbuffered SO-DIMMs
  • 72-bit DDR SDRAM memory (64-bit interface + 8-bit ECC)
  • Up to 3.2 GB/s memory bandwidth
  • ECC protection enables increased system reliability

HyperTransport™ technology for high speed I/O communication
  • One 16-bit link supporting up to 1600MHz (1600MT/s)
  • Up to 6.4GB/s peak HyperTransport I/O bandwidth

Large high performance on-chip cache
  • 64KB Level 1 instruction cache
  • 64KB Level 1 data cache
  • Up to 1MB Level 2 cache
  • Improved branch prediction for greater accuracy in anticipating instruction calls
  • Enhanced TLB structures for better memory management of complex workloads

AMD PowerNow!™ technology for advanced power management
  • Maximizes your notebookIt's battery life
  • Provides performance on demand when required by the application
  • Allows notebook to run quieter


Wireless Compatibility

  • Fully compatible with currently available 802.11 a, b and g wireless solutions
  • AMD enables a choice of best-in-class wireless solutions


Packaging: 754-pin lidless micro PGA, organic package. Die size: Approximately 105.9 million transistors on 193mm2. Processors are manufactured using AMD's state-of-the-art 0.13-micron SOI technology at AMD's Fab 30 wafer fabrication facility in Dresden, Germany.



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